This invention introduces advanced liquid-cooled cold plates with localized micro-channel, pin fin, and lattice structures that deliver targeted hotspot cooling, quasi-uniform temp...
Supermicro is expanding its proven liquid-cooled and air-cooled high-performance fabric 8-GPU system, leveraging the open multi-architecture industry standard OCP Accelerator Module
To address this, an embedded microfluidic-cooled SiC power module is developed, combining embedded microchannels and nano-silver sintering to enable efficient and uniform cooling.
However, high-performance integrated TECs have been rarely explored for electronics cooling. The primary challenge lies in the difficulty of designing and fabricating such integrated TECs.
However, reporting on the impact of micropumps on the heat dissipation efficiency of microchannel cooling plates is rare. Further research is
Using wide bandgap power semiconductors in the power modules enables high-frequency and low-loss switching at relatively high temperatures for
Supermicro is expanding its proven liquid-cooled and air-cooled high-performance fabric 8-GPU system, leveraging the open multi-architecture industry
This thesis discusses the application of liquid immersion cooling technology in power electronic converter, paying special attention to its potential in improving thermal management, system
We designed a novel embedded liquid cooling module using Si 3 N 4 -based active metal brazing substrates, where microchannels were etched in the bottom copper layer to enhance thermal
Our collection of liquid-cooled products covers a wide range of applications JetCool''s innovative product suite uses its patented microconvective cooling® technology,
The findings demonstrated the improvement in thermal performance of the embedded liquid cooling module with Si 3 N 4 -based active metal brazing substrates for high-power
The present study investigates thermal management of industrially relevant high-capacity, high-rate liquid-cooled battery modules.
MicroModular™ by LiquidStack offers efficient liquid cooling in a compact modular container, ideal for scalable infrastructure and flexible data
The other module is well suited for stacking in series for high voltage applications and provides both top and bottom surfaces for “double sided”
Our liquid-to-chip solution, SmartLid™, offers exceptional cooling performance for high-power electronics, bringing fluid directly to the processing chip, and
To fully leverage the advantages of silicon carbide (SiC) power devices, this study presents a substrate-embedded SiC power module with integrated liquid cooling.
In this Article, we report an embedded microfluidic cooling strategy that is capable of dissipating heat fluxes up to 3,000 W cm −2 at a pumping power of
Abstract In this study, the cooling capability of a novel design liquid jet impingement multi-micro nozzle cooling system for a high heat flux commercial Si-IGBT power modules has been
To support the deployment of the FlexTwin architecture at scale, Supermicro offers rack-scale integration services to design, build, validate, and
, a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry''s transition to liquid-cooled data centers with the NVIDIA
Traditional air cooling methods are often unable to effectively maintain optimal operating temperatures in high-performance applications. Liquid cooling technology is a promising solution that offers superior
This invention introduces advanced liquid-cooled cold plates with localized micro-channel, pin fin, and lattice structures that deliver targeted hotspot cooling, quasi-uniform temperatures, and reduced
Complete and Integrated Liquid-Cooling Solutions Make Direct Liquid Cooling Infrastructure easy for customers to deploy and maintain, including the facility-side cooling tower.
An efficient battery pack-level thermal management system was crucial to ensuring the safe driving of electric vehicles. To address the challenges posed
Their design innovations include efficient heat extraction from CPU and GPU chips with a liquid cooled loop and dissipation of this heat to the ambient by use of high-efficiency, low-cost heat exchangers.
To address the challenges posed by insufficient heat dissipation in traditional liquid cooled plate battery packs and the associated high system
The rapid development of high-power-density semiconductor devices has rendered conventional thermal management techniques inadequate for
An embedded microfluidic cooling approach—consisting of an integrated manifold layer, jet plate and sawtooth-shaped microchannels—can
Microchannel liquid-cooled plates are widely used in high-performance electronic devices, but their heat transfer performance and pressure
San Jose, Calif., – October 15, 2024 – Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the
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